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Magnachip Semiconductor Corp (MX) delivers analog and mixed-signal solutions powering consumer electronics, automotive systems, and industrial applications worldwide. This dedicated news hub provides investors and industry professionals with timely updates on MX's strategic developments, technological innovations, and market positioning.
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Key updates include financial performance insights, R&D breakthroughs in power conversion technologies, and operational developments across MX's South Korean headquarters and international facilities. Bookmark this page for direct access to verified information supporting informed analysis of MX's role in IoT, automotive electronics, and high-volume manufacturing sectors.
Magnachip (NYSE: MX) announced a strategic agreement with Hyundai Mobis to use jointly developed high-performance IGBT technology and to expand its industrial IGBT business.
The companies have collaborated since 2015; Mobis plans to begin mass production of inverters using these IGBTs in 2026. Magnachip intends to launch a new series of industrial IGBTs in the first half of 2026 and to target industrial, AI and renewable energy markets.
Market context: global IGBT value exceeded $11 billion in 2024 and is projected from $12.3B in 2025 to $16.9B by 2028. Magnachip describes the products as a new seventh-generation IGBT family to strengthen competitiveness.
Magnachip (NYSE: MX) launched two new 650V Super Junction (SJ) MOSFETs in a 4-pin TO-Leadless (TOLL) package with an integrated Kelvin source, targeting premium consumer electronics and high-power/high-current markets including AI laptop adapters and chargers.
The 4-pin TOLL design is stated to deliver >100% higher current capability versus D2PAK, a 24% smaller footprint, and a 48% lower height. Two parts are listed with RDS(on) of 99mΩ and 130mΩ at 650V. Magnachip said it will expand the 600V TOLL lineup for AI datacenter and high-power applications.
Magnachip (NYSE: MX) will report third quarter 2025 financial results for the period ended September 30, 2025, on Monday, November 3, 2025 after market close.
The company will host a conference call on November 3, 2025 at 2:00 p.m. PT / 5:00 p.m. ET. Participants must complete online registration in advance to receive dial‑in numbers, a PIN, and joining instructions.
A live and archived webcast and a copy of the earnings release will be available in the Investors section of www.magnachip.com.
Magnachip Semiconductor (NYSE: MX) announced the immediate departure of CEO YJ Kim, with Board Chairman Camillo Martino stepping in as Interim CEO. The leadership change comes as the company faces strategic challenges in its transition to becoming a pure-play power semiconductor company.
As part of the strategic restructuring, Magnachip plans to reduce capital expenditures by over 50% through 2027, lowering CAPEX forecast from $65-70 million to $30-35 million. The company's net cash outlay is expected to be $12-13 million, with the remainder covered by bank equipment loans. Additional cost-cutting measures include headcount reductions targeting $2-3 million in annual operating expense savings. The Board is also exploring strategic alternatives, including a potential sale of the company.
Magnachip (NYSE: MX) reported Q2 2025 financial results, marking its fifth consecutive quarter of year-over-year growth from continuing operations. Revenue increased 8.1% year-over-year to $47.6 million, with consolidated gross profit margin at 20.4%.
The company's Power Analog Solutions (PAS) segment saw significant growth, with communications applications revenue up 46.7% and computing applications up 45.1% year-over-year. The Power IC business grew 11.1% year-over-year. The company launched 28 new-generation PAS products and secured 71 design-wins in Q2.
However, Magnachip revised its full-year 2025 outlook, now expecting flat revenue growth compared to previous mid-to-high single-digit growth forecasts, citing tariff uncertainty and pricing pressures in China.
Magnachip (NYSE: MX) has launched a new 80V MXT MV MOSFET (MDLT080N017RH) featuring an innovative TOLT (TO-Leaded Top-Side Cooling) package design. The company has already begun supplying this new product to a leading global electric motor manufacturer.
The TOLT package represents a significant advancement in thermal management, achieving an average 22% reduction in junction temperature compared to standard TOLL packages. This improvement is achieved through direct heat dissipation from the top via a mounted metal heat sink, unlike conventional bottom-cooling designs.
The new MOSFET is specifically designed for e-scooters and Light Electric Vehicles (LEVs), offering enhanced system reliability, compact design capabilities, and improved power efficiency without compromising current-handling capability and thermal safety margins.
Magnachip Semiconductor (NYSE: MX) has scheduled its second quarter 2025 financial results announcement for Thursday, July 31, 2025, after market close. The company will host a conference call at 2:00 p.m. PT / 5:00 p.m. ET to discuss the results.
Participants must pre-register online to join the conference call. The earnings release and webcast will be available in the Investors section of Magnachip's website.